Hybrid -- Registered authors can present their work online or face to face New
11th International Conference on Signal and Image Processing (SIPRO 2025) is a forum for presenting new advances and research results in the fields of Digital Image Processing. The conference will bring together leading researchers, engineers and scientists in the domain of interest from around the world. The scope of the conference covers all theoretical and practical aspects of the Signal, Image Processing & Pattern Recognition. Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experience.
Authors are solicited to contribute to the conference by submitting articles that illustrate research results, projects, surveying works and industrial experiences that describe significant advances in the areas of Signal, Image Processing & Pattern Recognition.
Topics of interest
Authors are invited to submit papers through the conference Submission System by May 17, 2025(Final Call) . Submissions must be original and should not have been published previously or be under consideration for publication while being evaluated for this conference. The proceedings of the conference will be published by Computer Science Conference Proceedings in Computer Science & Information Technology (CS & IT) series (Confirmed).
Selected papers from SIPRO 2025, after further revisions, will be published in the special issue of the following journals
Important Dates
Third Batch : (Submissions after March 30, 2025)
CONFERENCE PROCEEDINGS
Hard copy of the proceedings will be distributed during the Conference. The softcopy will be available on AIRCC Digital Library

Jiating (Kristin) Chen
AI Research Lab, United States
USA

Ruibo Song
United States

Lalith Sriram Datla
GE Healthcare
USA

Kailash Thiyagarajan
Independent Researcher
USA

Xin Sun
Linköping University
Sweden

Zainab Ahmad
Instituto Politécnico Nacional
Mexico

Nikitha Merilena Jonnada
University of the Cumberlands
USA

Tanja Steigner
Emporia State University
USA

Gianni Jacucci
University of Trento
Italy

Thibault Rousset
McGill University
Canada

Ahmad Mahmood
Instituto Politécnico Nacional
Mexico

Samah Kansab
École de technologie supérieure (ÉTS)
Canada

Vaani Bansal
PES University
India

Bruno Campos
MacEwan University
Canada

Sedigheh Mahdavi
AI Research Lab
Canada

Dhvani Upadhyay
Dhirubhai Ambani University
India

Meet Raval
University of Southern California
United States

Tejul Pandit
DPalo Alto Networks
United States

Evan Lu
USA

Swetha Talakola
Quality Engineer III at Walmart, Inc
USA

Weibing Zheng
University of Cincinnati
USA
Paper Submission
Sample Template
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